The annual working meeting of the special coordination mechanism for the development of the basic electronic components industry was held in Shenzhen
On April 13, 2023, the annual working meeting of the special coordination mechanism for the development of the basic electronic components industry (hereinafter referred to as the "coordination mechanism") was held in Shenzhen. Wang Jiangping, a member of the party group and deputy minister of the Ministry of Industry and Information Technology, presided over the meeting and delivered a speech.
The meeting pointed out that electronic components are the cornerstone to support the development of the information technology industry, and also the key to ensuring the safety and stability of the industrial chain supply chain. In 2021, the Ministry of Industry and Information Technology issued the "Action Plan for the Development of Basic Electronic Components Industry (2021-2023)" (hereinafter referred to as the "Action Plan"), and established a coordination mechanism to organize some key provinces, regions and cities to strengthen system planning and overall planning Layout, solidly promote the effective implementation of the "Action Plan".
The meeting emphasized that all relevant units should play a good role in the coordination mechanism, strengthen the coordinated efforts of the central and local governments, increase the investment of policy resources, and implement the tasks of the "Action Plan". It is necessary to thoroughly implement the "Opinions on Deepening the Reform of the Management System of the Electronic and Electrical Industry", and promote the coordinated development of all links in the basic electronic industry chain such as electronic components, electronic materials, electronic special equipment, and measuring instruments. It is necessary to adhere to a high level of opening up to the outside world, strengthen communication and industrial chain docking, and jointly promote the high-quality development of the electronic components industry.
Relevant persons in charge of the member units of the coordination mechanism, as well as representatives of the International Trading Center for Electronic Components and Integrated Circuits, China Electronics Standardization Research Institute, and China Electronic Product Reliability and Environmental Testing Research Institute attended the meeting.
